由于板子空间限制，我只能使用DDPAK贴片封装的OPA544芯片。我是用3个此高压运放驱动三相电机，负载比较大，相电压约为17V，相电流约为0.8A，OPA544发热会非常严重。只借助PCB板上铺铜区域是无法满足散热要求的。请问有没有其他的散热方式？ 在OPA544芯片的上表面（标记信号的面）用导热硅胶粘上散热片的方式可不可行？ OPA544芯片的黑色主体材料导热性好不好？
↧
Channel:
放大器论坛 - 最近的话题
X
Are you the publisher?
Claim or
contact us
about this channel.
X
0
Channel Details:
- Title: 放大器论坛 - 最近的话题
- Channel Number: 62155573
- Language: Chinese
- Registered On: March 23, 2016, 12:00 am
- Number of Articles: 3845
- Latest Snapshot: May 10, 2022, 11:23 am
- RSS URL: http://www.deyisupport.com/question_answer/analog/amplifiers/f/52/rss.aspx?mode=0
- Publisher: https://e2echina.ti.com/support/amplifiers/f/amplifiers-forum
- Description:
- Catalog: //undercoater66.rssing.com/catalog.php?indx=62155573
© 2025 //www.rssing.com